Khoom Taw Qhia
TG5880 yog ib qho tshwj xeeb interface ntim cov khoom siv nrog cov thermal conductivity uas yog ua los ntawm silicone resin los ntawm cov mis tshwj xeeb thiab cov txheej txheem. Tsawg interfacial thermal kuj tuaj yeem ua tiav ntawm qhov qis qis. Nws tuaj yeem siv los ntawm cov khoom siv hluav taws xob cua sov thiab hluav taws xob txhuas los yog lub plhaub kom tshem tawm cov huab cua zoo, uas tuaj yeem txo cov huab cua tiv thaiv thermal thiab ua tiav cov txiaj ntsig zoo.
Muaj Configuration
1kg / Thawv, 2kg / Can, 10kg / chim, 30cc / Syringe.
Product Performance
Zoo thermal conductivity thiab thermal tsis kam;
Zoo wettability thiab hluav taws xob rwb thaiv tsev;
Tsawg ntom ntom thiab kev tsim kho zoo;
Kev ntseeg tau zoo
Nta
|
PROPERTIES |
SPECIFICATIONS |
TEST STANDARD |
|
Xim |
Grey |
Kev tshuaj xyuas qhov muag |
|
Qhov ceev (g / cm³) |
2.85 ± 0.30 |
ASTM D 792 Cov Lus Qhia Tshwj Xeeb |
|
Viscosity @23℃(cps) |
3.5 × 10⁵ |
Brookfield DV-II+ Spindle-T-F; Ceev 10 rpm |
|
Surface Resistance (Ω) |
Loj dua los yog sib npaug rau 2.0 × 10⁹ |
ASTM D 257 Cov |
|
Thermal conductivity W / (m·K) |
3.50 ± 0.35 (nrog hnyav) |
ISO 22007-2: 2008 (ob leeg) |
|
Thermal Resistance @40psi (degree · in²/W) |
0.011 |
ASTM D 5470 Cov Lus Qhia Tshwj Xeeb |
|
Kev Ua Haujlwm Kub (degree) |
-40 ~ 125 |
Saintyoo TM |
▉ Thermal Conductivity Test Method
Khoom siv
Cov khoom siv dav siv hauv Computer Processor CPUs, Chips thiab Chipsets, Kev Siv Hluav Taws Xob thiab UPS, Graphics Card GPUs, LCD thiab PDP Phaj Phaj Zaub, Cov Khoom Siv Loj thiab lwm yam khoom siv hluav taws xob ntawm cov khoom siv cua sov thiab cov hluav taws xob hluav taws xob txhuas ntawv lossis plhaub ntim thiab cov khoom siv hluav taws xob thiab lwm yam.
Duration thiab Kev Cia Siab
Qhov zoo tshaj yog siv ua ntej: 12 lub hlis
Qhov Zoo Tshaj Plaws Cia: 15℃~ 35℃/ 0 ~ 65% RH hauv cov ntaub ntawv.
Cim npe nrov: heat-ua roj, Tuam Tshoj tshav kub-ua roj manufacturers, lwm tus neeg, Hoobkas
