Theem hloov cov ntaub ntawv
Thermally conductive theem hloov
Cov yam ntxwv ntawm thermally conductive theem hloov cov ntaub ntawv
Vim li cas ho xaiv thermally conductive theem hloov cov ntaub ntawv?
Tsawg Thermal Resistance:Thermal hloov cov ntaub ntawv sib txuas ua ke muab qhov zoo ntawm ob qho tib si thermal pads thiab thermal paste. Ua ntej mus txog theem hloov kub, lawv muaj qhov zoo sib xws rau cov ntaub qhwv thermal, nthuav tawm zoo elasticity thiab plasticity. Txawm li cas los xij, thaum ua haujlwm kub ntawm cov khoom siv hluav taws xob nce siab tshaj lawv cov ntsiab lus melting, lawv tau hloov mus rau theem hloov mus rau lub xeev ua kua, ua kom zoo wetting lub thermal interface. Lawv kuj muaj tib lub peev xwm ua tau raws li thermal muab tshuaj txhuam, ua kom tiav qhov ntim ntawm interfacial voids thiab txo qhov thermal kuj ntawm ob cov ntaub ntawv.
Thaum tshav kub kub Cia:Theem hloov thermal interface cov ntaub ntawv kuj muaj lub zog buffering nyhuv. Los ntawm kev nqus los yog tso tawm cov cua sov thaum lub sij hawm hloov cov txheej txheem, lawv ua rau txoj hauv kev rau cov cua sov dissipation, ua kom yooj yim rau kev nthuav tawm thiab nthuav tawm ntawm cov cua sov seem, tiv thaiv qhov kub thiab txias, thiab txo qhov kev khiav hauj lwm kub ntawm cov cuab yeej, yog li txuas lawv lub neej kev pab cuam.
Daim ntawv thov scenarios ntawm thermally conductive theem hloov nplooj ntawv
Chips nrog siab kub dissipation zog:Xws li CPUs hauv PCs, server CPU chips, thiab GPUs hauv cov ntawv teev lus. High thermal conductivity yog xav tau rau cov ntaub ntawv interface.
Feem ntau siv hauv cov dab dej kub thiab nruab nrab ntawm cov khoom siv hluav taws xob hauv siab - zaus microprocessors, laptops, cache chips, nco modules, computer servers, khoom-state relays, power modules, image processing chips, ASICs, thiab IGBTs.
Yuav hloov thermal roj:Thermal theem hloov nplooj ntawv, feem ntau 0.2 hli tuab; thermal roj yog luam tawm mus rau lub thickness ntawm 0.2 hli; zoo dua twj tso kua mis- tawm tsis kam thiab ntev lifespan dua thermal roj.
Daim ntawv thov cov txheej txheem ntawm Thermal Storage Materials
Ternary lub ntsiab theem hloov khoom qauv:PC400, PC500, PC790
Yuav ua li cas siv thermally conductive theem hloov nplooj ntawv
Theem hloov cov ntaub ntawv
Thermal theem hloov
Phase hloov thermal cia
Thermal cia vs. thermal conduction
| Spheres | Cov khoom siv phab ntsa capsule encapsulates ib theem hloov khoom siv. Thaum qhov kub thiab txias, cov khoom siv encapsulated hloov los ntawm cov khoom mus rau lub xeev ua kua, absorbing zog -qhov no yog theem hloov thermal cia. Txawm li cas los xij, tag nrho daim ntawv -zoo li cov qauv tseem tsis hloov, yog li nws yuav tsis muag lossis ntws. |  |
| Substrate | Organosilicon | |
| Khoom siv Encapsulation | Microcapsules |
Thermal cia vs. thermal conduction
| Cov Khoom Siv Hluav Taws Xob | Cov khoom siv thermal conductive | |
| Kev sib xyaw | Substrate + Paraffin Phase Hloov Khoom | Substrate + Thermal Conductive Powder |
| Key Parameters | Enthalpy (J / g) | Thermal conductivity |
Phase hloov thermal cia
Vim li cas thiaj xaiv cov khoom siv thermal cia?
Yuav kom txo qis tus nqi ntawm qhov kub nce, indirectly txo qhov siab tshaj plaws kub.
- Daim ntawv thov scenarios: Scenarios nrog kev hloov pauv thaum tshav kub kub.
Thaum tshav kub kub cia - tshav kub tso tawm, nruam voj voog:
- Piv txwv li: Watches, koob yees duab, them modules, thiab lwm yam.
Daim ntawv thov cov txheej txheem ntawm Thermal Storage Materials
Ternary theem hloov khoom qauv:
- Daim ntawv: 140 J / g, 180 J / g; Thermal conductivity 3.5 W, 140 J / g
- Phase hloov thermal cia gel: 140 J / g
